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HCS163MS

Die Characteristics

DIE DIMENSIONS:

104 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

GLASSIVATION:

Thickness: 13k

Å

WORST CASE CURRENT DENSITY:

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCS163MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCS163 is TA14348A.

MR

CP

P0

P1

P2

P3

PE

GND

SPE

TE

Q3

Q2

Q1

Q0

TC

VCC

Spec Number

518835