Data Sheet G13567EJ3V0DS00

18

µµµµ PC1934

6.

RECOMMENDED SOLDERING CONDITIONS

Recommended solder conditions for this product are described below.

For details on recommended soldering conditions, refer to Information Document “Semiconductor Device Mounting

Technology Manual” (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Surface Mount Type

µµµµ PC1934GR-1JG: 16-pin plastic SSOP (5.72 mm (225))

µµµµ PC1934GR-PJG: 16-pin plastic TSSOP (5.72 mm (225))

Soldering Method

Soldering Conditions

Symbol of Recommended

Conditions

Infrared reflow

Package peak temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.),

Number of times: 3 MAX.

IR35-00-3

VPS

Package peak temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),

Number of times: 3 MAX.

VP15-00-3

Wave soldering

Soldering bath temperature: 260 °C MAX., Time: 10 seconds MAX.,

Number of times: 1,

Preheating temperature: 120 °C MAX. (package surface temperature)

WS60-00-1

Caution Do not use two or more soldering methods in combination.