HIP0060 datasheet(2/7 Pages) INTERSIL

2 / 7 page

Absolute Maximum Ratings

Thermal Information

Max Output Voltage, VOUT (Note 2) . . . . . . . . . . . . . . . . . . . . . VOC

Max Output Load Current, ILOAD (Per Output, Note 3) . . . . . . . . ICL

Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V

Logic Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V

Operating Conditions

Ambient Temperature Range . . . . . . . . . . . . . . . . . -40oC to 125oC

Junction Temperature Range . . . . . . . . . . . . . . . . -40oC to 150oC

Thermal Resistance (Typical, Notes 1, 4)

θJA (oC/W)

SOIC - PC Board Mount, Min. Copper . . . . . . . . . .

SOIC - PC Board Mount, 2 sq. in. Copper . . . . . . . .

Maximum Storage Temperature Range -55oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

θJA is measured with the component mounted on an evaluation PC board in free air.

2. The MOSFET Output Drain is internally clamped with a Drain-to-Gate zener diode that turns on the MOSFET; holding the Drain at the

Output Clamp voltage VOC.

3. The output drive is protected by an internal current limit. The ICL over-current limiting threshold parameter specification defines the max-

imum current. The maximum current with all outputs ON may be further limited by dissipation.

4. Device dissipation is based on thermal resistance capability of the package in a normal operating environment. The junction to ambient

thermal resistance of 60oC/W is defined here as a PC Board mounted device with minimal copper. With approximately 2 square inches

of copper area as a heat sink, it is practical to achieve 35oC/W thermal resistance. Further reduction in the thermal resistance can be

achieved with additional PC Board Copper ground area or an external heat sink structure next to the ground leads at the center of the

package.

Electrical Speciﬁcations

VDD = 4.5V to 5.5V, VSS = 0V, TA = -40

oC to 125oC; Unless Otherwise Speciﬁed

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

OUTPUTS DRIVERS (DR0 TO DR7)

Output Channel Resistance

rDSON

IOUT = 0.5A

0.8

Ω

Over-Current Limiting Threshold

ICL

1.5

3.5

Output Clamping Voltage

VOC

Output Clamping Energy

EOC

1ms Single Pulse Width, TA = 25

oC,

(Refer to Figure 3 for SOA Limits).

-85-

Output OFF Leakage Current

ILK

VOUT = 14.5V

180

µA

Open-Load Fault Threshold

ROLD

VOUT = 14.5V, Output Off

200

Ω

Output Rise Time

RL = 30Ω, VOUT = 14.5V

µs

Output Fall Time

RL = 30Ω, VOUT = 14.5V

µs

Turn-On Delay

tON

RL = 30Ω, VOUT = 14.5V

µs

Turn-Off Delay

tOFF

RL = 30Ω, VOUT = 14.5V

µs

POWER SUPPLY

Power On Reset Threshold

VDD(POR)

3.2

4.4

VDD Logic Supply Current

IDD

All Outputs ON or OFF

LOGIC INPUTS (INx, SI, SCK, RST, CS)

High Level Input Voltage

VIH

0.7xVDD

Low Level Input Voltage

VIL

0.2xVDD

Input Hysteresis

VILHYS

0.8

High Output Voltage, SO, INT

VOL

Current Sink = 1.6mA

0.4

Low Output Voltage, SO

VOH

Current Source = -0.8mA

VDD-0.8

Input Pull-Down Current, INx

IINPD

250

µA

Reset Input Pull-Up Current, RST

IRPU

120

µA

HIP0060

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