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HIP6005 Datasheet(PDF) 10 Page - Intersil Corporation

Part # HIP6005
Description  Buck Pulse-Width Modulator (PWM) Controller and Output Voltage Monitor
PDF  12 Pages
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HIP6005 Datasheet(HTML) 10 Page - Intersil Corporation

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10
temperature by calculating the temperature rise according
to package thermal-resistance specifications. A separate
heatsink may be necessary depending upon MOSFET
power, package type, ambient temperature and air flow.
Standard-gate MOSFETs are normally recommended for
use with the HIP6005. However, logic-level gate MOSFETs
can be used under special circumstances. The input voltage,
upper gate drive level, and the MOSFETs absolute
gate-to-source voltage rating determine whether logic-level
MOSFETs are appropriate.
Figure 10 shows the upper gate drive (BOOT pin) supplied
by a bootstrap circuit from VCC. The boot capacitor, CBOOT,
develops a floating supply voltage referenced to the PHASE
pin. This supply is refreshed each cycle to a voltage of VCC
less the boot diode drop (VD) when the schottky diode, D2,
conducts. Logic-level MOSFETs can only be used if the
MOSFETs absolute gate-to-source voltage rating exceeds
the maximum voltage applied to VCC.
Figure 11 shows the upper gate drive supplied by a direct
connection to VCC. This option should only be used in
converter systems where the main input voltage is +5VDC
or less. The peak upper gate-to-source voltage is
approximately VCC less the input supply. For +5V main
power and +12VDC for the bias, the gate-to-source voltage
of Q1 is 7V. A logic-level MOSFET is a good choice for Q1
under these conditions.
Schottky Selection
Rectifier D2 conducts when the upper MOSFET Q1 is off. The
diode should be a Schottky type for low power losses. The
power dissipation in the schottky rectifier is approximated by:
In addition to power dissipation, package selection and
heatsink requirements are the main design trade-offs in
choosing the schottky rectifier. Since the three factors are
interrelated, the selection process is an iterative procedure.
The maximum junction temperature of the rectifier must
remain below the manufacturer’s specified value, typically
125oC. By using the package thermal resistance specification
and the schottky power dissipation equation (shown above),
the junction temperature of the rectifier can be estimated. Be
sure to use the available airflow and ambient temperature to
determine the junction temperature rise.
PCOND = IO
2 • rDS(ON) • D
Where: D is the duty cycle = VOUT / VIN,
tSW is the switching interval, and
FS is the switching frequency.
PSW = 1/2 IO • VIN • tSW • FS
+12V
HIP6005
GND
UGATE
PHASE
BOOT
VCC
+5V OR +12
NOTE: VG-S ≈ VCC - VD.
FIGURE 10. UPPER GATE DRIVE - BOOTSTRAP OPTION
(NOTE)
CBOOT
DBOOT
Q1
D2
+
-
+ VD -
+12V
HIP6005
GND
UGATE
PHASE
BOOT
VCC
+5V OR LESS
Q1
+
-
IGURE 11. UPPER GATE DRIVE - DIRECT VCC DRIVE OPTION
D2
NOTE:
VG-S ≈ VCC -5V
PCOND = I0 x Vf x (1 - D)
Where: D is the duty cycle = VOUT / VIN, and
Vf is the Schottky forward voltage drop
HIP6005



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