µPC2900 Series

17

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our

sales offices.

Fof more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Surface mount devices

µPC2900T Series: MP-3Z

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

IR35-00-2

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 2 times.

VPS

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-2

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 2 times.

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

Partial heating method

Pin temperature: 300

°C or below,

—

Heat time: 3 seconds or less (Per each side of the device).

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

Through-hole devices

µPC2900HF Series: MP-45G

µPC2900HB Series: MP-3

Process

Conditions

Wave soldering

Solder temperature: 260

°C or below,

(only to leads)

Flow time: 10 seconds or less.

Partial heating method

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (Per each pin).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.