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µPC29L00 Series

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

TYPES OF THROUGH HOLE MOUNT DEVICE

µPC29L00J Series

Soldering Process

Soldering Conditions

Symbol

Wave soldering

Solder temperature: 260 ˚C or below.

Flow Time: 10 seconds or below.

TYPES OF SURFACE MOUNT DEVICE

For more details, refer to our document “Semiconductor Device Mounting Manual” (IEI-1207).

µPC29L00T Series

Soldering Process

Soldering Conditions

Symbol

Infrared ray reflow

Peak package’s temperature: 235 ˚C or below.

IR35-00-2

Reflow time: 30 seconds or below (210 ˚C or higher).

Vapor phase soldering

Peak package’s temperature: 215 ˚C or below.

VP15-00-2

Reflow time: 40 seconds or below (200 ˚C or higher).

Wave soldering

Solder temperature: 260 ˚C or below.

WS60-00-1

Flow time: 10 seconds or below.

Note Exposure limit before soldering after dry-pack package is opened.

Remark Storage conditions: 25 ˚C and relative humidity at 65 % or less.

Caution Do not apply more than a single process at once, except for “Partial heating method”.

REFERENCE

Document Name

Document No.

NEC semiconductor device reliability/quality control system.

IEI-1212

Quality grade on NEC semiconductor devices.

IEI-1209

Semiconductor device mounting technology manual.

IEI-1207

Semiconductor device package manual.

IEI-1213

Guide to quality assurance for semiconductor devices.

MEI-1202

Semiconductor selection guide.

MF-1134