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MD1S Datasheet(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH

Part # MD1S
Description  0.8 Amp Surface Mount Bridge Rectifiers
PDF  2 Pages
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Manufacturer  SECOS [SeCoS Halbleitertechnologie GmbH]
Direct Link  http://www.secosgmbh.com
Logo SECOS - SeCoS Halbleitertechnologie GmbH

MD1S Datasheet(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH

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Elektronische Bauelemente
MD1S ~ MD7S
Voltage 50V ~ 1000V
0.8 Amp Surface Mount Bridge Rectifiers
11-Jul-2013 Rev.B
Page 1 of 2
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
FEATURES
Plastic material has UL flammability classification 94V-0
High surge current capability
Saves space on printed circuit boards
Glass passivated structure
MECHANICAL DATA
Case: Molded plastic body over passivated junctions
Polarity: As marked on body 
Mounting position: Any
PACKAGE INFORMATION
Package
MPQ
Leader Size
MDS
3K
13 inch
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Rating 25°C ambient temperature unless otherwise s pecified. Single phase half wave, 60Hz, resistive or inductive load.
For capacitive load, de-rate current by 20%.)
Part Number
Parameter
Symbol
MD1S
MD2S
MD3S
MD4S
MD5S
MD6S
MD7S
Unit
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
V
On glass-epoxy
P.C.B.
0.5
Maximum Average
Forward Current
On aluminum
substrate
IF(AV)
0.8
A
Peak Forward Surge Current 8.3 ms Single Half
Sine-Wave Superimposed on Rated Load
(JEDEC Method)
IFSM
30
A
Maximum instantaneous forward voltage @ 0.4A
per leg
VF
1
V
TA=25°C
5
Maximum DC Reverse Current
at Rated DC Blocking Voltage
TA=125°C
IR
500
µA
Rating for fusing, 1ms≦t≦8.3ms
I
2
T
5
A
2
S
Thermal resistance junction to ambient
1
RθJA
85
°C/W
Thermal resistance junction to Case
1
RθJC
22
°C/W
Thermal resistance junction to lead
1
RθJL
20
°C/W
Operating and Storage Temperature range
TJ, TSTG
-55~150
°C
Note:
1. On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads
2. On aluminum substrate P.C.B. with area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad
MDS
Millimeter
Millimeter
REF.
Min.
Max.
REF.
Min.
Max.
A
-
7.0
G
1.3
1.7
B
3.5
4.2
H
0.48
1.1
C
0.4
0.8
I
0.1
0.45
D
2.3
2.7
J
0.2(TYP.)
E
4.5
5.0
K
0.5*15°
F
2.3
2.7


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