●USP-4 Power Dissipation

Power dissipation data for the USP-4 is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as the reference data taken in the following condition.

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: Dimensions 40 x 40 mm (1600 mm2 in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material: Glass Epoxy (FR-4)

Thickness: 1.6 mm

Through-hole: 4 x 0.8 Diameter

2. Power Dissipation vs. Ambient Temperature (85℃)

Board Mount (Tjmax=125℃)

3. Power Dissipation vs. Ambient Temperature (105℃)

Board Mount (Tjmax=125℃)

Ambient

Temperature

(℃)

Power

Dissipation

Pd (mW)

Thermal

Resistance

(℃/W）

25

1000

100.00

85

400

Ambient

Temperature

(℃)

Power

Dissipation

Pd (mW)

Thermal

Resistance

(℃/W）

25

1000

100.00

85

200

Pd vs. Ta

Evaluation Board (Unit: mm)

Ambient Temperature Ta(℃)

Pd vs. Ta