●USP-4D Power Dissipation

Power dissipation data for the USP-4D is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

1.

Measurement Condition (Reference data)

Condition : Mount on a board

Ambient : Natural convection

Soldering : Lead (Pb) free

Board : Dimensions 40mm×40mm（1600mm

2

in one side）

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material : Glass Epoxy（FR-4）

Thickness : 1.6mm

Through-hole : 4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2.

Power Dissipation vs. Ambient temperature

Board Mount ( Tjmax=125℃)

Ambient Temperature (℃)

Power Dissipation Pd (mW)

Thermal Resistance (℃/W）

25

650

85

260

153.85