µPD16808

10

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the conditions described below.

For soldering methods and conditions other than those listed below, consult NEC.

Surface mount type

For the details of the recommended soldering conditions of this type, refer to Semiconductor Device Mounting

Technology Manual (C10535E).

Soldering Method

Soldering Conditions

Symbol of Recommended

Soldering

Infrared reflow

Peak package temperature: 230

°C, Time: 30 seconds MAX. (210 °C MIN.),

IR30-00

VPS

Peak package temperature: 215

°C, Time: 40 seconds MAX. (200 °C MIN.),

VP15-00

Wave soldering

Solder bath temperature: 260

°C MAX., Time: 10 seconds MAX.,

WS60-00

Partial heating

Pin temperature: 300

°C MAX., Time: 10 seconds MAX.,

–

Note The number of storage days at 25

°C, 65 % RH after the dry pack has been opened

Caution Do not use two or more soldering methods in combination (except partial heating).