Packing form description

TN1188

4/7

DocID026684 Rev 2

4

Packing form description

STMicroelectronics' aerospace packing procedure for products in die form is compliant with

the standard packing and shipment rules summarized below.

1.

Maximum tray number per shielding bag: 4

2.

Traceability information related to die quality level is labeled outside the shielding bag.

4.1

Packing information

ST aerospace dice are packed in waffle packs inside a clean room (Class 100, ISO 5).

Each bulk includes a maximum of 4 waffle packs for shipment.

The waffle packs are placed in antistatic bags and vacuum sealed.

The detailed packing procedure for packing of products in die form is summarized below

and illustrated in Figure 1.

1.

A white interleaf is placed above each tray.

2.

A cover is positioned on the top of each tray.

3.

A clip keeps the cover on the tray.

4.

A label is placed on the tray cover.

5.

Waffle packs are sealed under a vacuum in an inner antistatic bag (maximum 4 waffle

packs per inner antistatic bag).

6.

The whole package is placed in an outer antistatic bag (dry pack).

7.

A bag of clay desiccant for dehumidification and an MSL card (as a humidity indicator)

are placed on top side.

8.

The antistatic bag is sealed in a vacuum sealer.

Any repacking should follow precisely the same procedure.

Figure 1: Aerospace die packing procedure