August 2014

DocID023971 Rev 3

1/13

AN4211

Application note

Guidelines for soldering MEMS microphones

By Alessandro Morcelli

Introduction

This application note provides guidelines and recommendations for soldering MEMS

microphones on application boards. Microphones, as pressure sensors, sense the

mechanical stress coming from the PCB, hence this force should be kept to a minimum.

Printing and stencil parameters, followed by device footprints, recommended land and

stencil patterns, and process considerations are presented in this document.

The following guidelines have been developed for the MEMS microphone family

(MP45DT02, MP34DB01, MP34DT01, MP33AB01, and MP33AB01H) offered by

STMicroelectronics.

Demonstration boards (STEVAL-MKI129Vx) for the evaluation and promotion of the

MP45DT02, MP34DT01, and MP34DT01 are also available. Please refer to AN4184

"Microphone coupon boards STEVAL-MKI129Vx based on the MP45DT02, MP34DB01,

Figure 1. Mechanical specifications for soldering

www.st.com