IRSF3021 datasheet(2/6 Pages) IRF

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IRSF3021

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. (Tc = 25°C unless

otherwise specified.)

Minimum Maximum Units

Test Conditions

Vds, max Continuous Drain to Source Voltage

Vin, max Continuous Input Voltage

-0.3

Ids

Continuous Drain Current

self limited

Power Dissipation

Tc ≤ 25°C

EAS

Unclamped Single Pulse Inductive Energy

200

Vesd1

Electrostatic Discharge Voltage (Human Body Model)

4000

1000pF.1.5kΩ

Vesd2

Electrostatic Discharge Voltage (Machine Model)

1000

200pF,0Ω

TJop

Operating Junction Temperature Range

-40

self-limited

TStg

Storage Temperature Range

-40

175

°C

Lead Temperature (Soldering, 10 seconds)

300

Switching ElectricalCharacteristics

(VCC = 14V, Resistive Load (RL) = 10Ω, Rin= 100Ω. Specifications measured at TC= 25°C unless otherwise specified.)

Minimum Typical Maximum Units Test Conditions

tdon

Turn-On Delay Time

Vin= 0V to 5V, 50% to 90%

Rise Time

µs

Vin= 0V to 5V, 90% to 10%

tdoff

Turn-Off Delay Time

Vin= 0V to 5V, 50% to 10%

Fall Time

Vin= 0V to 5V, 10% to 90%

Output Positive Slew Rate

-4

V/µs

Vin= 0V to 5V, +dVds/dt

Output Positive Slew Rate

-4

Vin = 0V to 5V, -dVds/dt

Minimum Typical Maximum Units Test Conditions

Vds,clamp Drain to Source Clamp Voltage

Ids= 6A, tp = 700 µS

Rds(on)

Drain to Source On Resistance

155

200

mΩ

Vin = 5V, Ids = 2A

Idss

Drain to Source Leakage Current

250

µA

Vds = 40V, Vin = 0V

Vth

Input Threshold Voltage

1.0

2.0

3.0

Vds = Vin, Ids + Iin= 10mA

Ii,on

Input Supply Current (Normal Operation)

100

300

µA

Vin = 5V

Ii,off

Input Supply Current (Protection Mode)

500

µA

Vin = 5V

Vin, clamp Input Clamp Voltage

Iin = 1mA

Vsd

Body-Drain Diode Forward Drop

1.5

Ids = -2A, Rin = 1kΩ

Static Electrical Characteristics

(Tc = 25°C unless otherwise specified.)

Minimum Typical Maximum Units Test Conditions

RΘjc

Junction to Case

°C/W TO-220AB

RΘjA

Junction to Ambient

RΘjc

Junction to PCB

°C/W SOT-223

RΘjA

Junction to PCB

Thermal Characteristics

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