UPD178002 datasheet(39/48 Pages) NEC

39 / 48 page

µPD178002, 178003

Data Sheet U12628EJ3V0DS00

12. RECOMMENDED SOLDERING CONDITIONS

The

µPD178002 and 178003 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales represen-

tative.

Table 12-1. Surface Mounting Type Soldering Conditions

µPD178002GC-×××-3B9:

80-pin plastic QFP (14

× 14 mm, 0.65 mm pitch)

µPD178003GC-×××-3B9:

80-pin plastic QFP (14

× 14 mm, 0.65 mm pitch)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

IR35-00-3

VPS

VP15-00-3

Wave soldering

WS60-00-1

Partial heating

—

Caution Do not use different soldering methods together (except for partial heating).

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C or higher),

Count: Three times or less

Package peak temperature: 215

°C, Time: 40 seconds max. (at 200°C or higher),

Count: Three times or less

Solder bath temperature: 260

°C max., Time: 10 seconds max., Count: once,

Preheating temperature: 120

°C max. (package surface temperature)

Pin temperature: 300

°C max., Time: 3 seconds max. (per pin row)

UPD178002 Datasheet(PDF) 39 Page - NEC