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AN1376 Datasheet(PDF) 26 Page - STMicroelectronics |
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AN1376 Datasheet(HTML) 26 Page - STMicroelectronics |
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26 / 35 page ![]() AN1376 APPLICATION NOTE 26/35 18 THERMAL MEASURES In order to check the reliability of the design a thermal mapping by means of an IR Camera was done. Here below the thermal measures on the board, at both nominal input voltages at ambient temperature (24 °C) are shown. The pointers A¸E have been placed across some key components, affecting the reliability of the circuit. The points correspond to the following com- ponents: As shown on the maps, all the other points of the board are within the temperature limits as- suring a reliable performance of the devices. Figure 28. component side A Input coil - L1 B PowerMOS – Q1 C +7V diode – D7 D +3.3V diode – D8 E +5V regulator – IC3 @115VAC - FULL LOAD COMPONENT SIDE A 47.41°C B 47.24°C C 78.39°C D 59.02°C E 70.67°C SMD SIDE |
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