AN2684

IFP006V1 demonstration board description

Doc ID 14266 Rev 1

11/21

4.4

IFP006V1 thermal management

The IFP006V1 PCB has two heatsinks: approximately 1 sq. cm on the top layer and 3 sq.

cm on the bottom layer, thermally interconnected through 9 vias, as shown in Figure 8.

limitation and in fast demagnetization, the power dissipation is much higher, requiring a low

thermal resistance through the device exposed tab, soldering space, top layer, vias and

bottom layer path. A 35 µm copper (10 oz/sq. ft) thickness and 0.3 mm diameter for the vias

are used according to EIA/JESD51-5.

Figure 8.

IFP006V1 PCB copper heatsink

Figure 9 and 11 show the IFP006V1 temperature map with all channels permanently

switched ON, 48

Ω loads, 24 V supply voltage and ambient temperature of 25 °C. The IC

temperature increase is only about a few degrees.

Figure 10 and 12 show a similar map when the IC is cycling at 1 Hz, 50% duty cycle, 48

Ω

1.2 H loads, 24 V supply voltage and ambient temperature of 25 °C.

Figure 9.

Thermal map in steady state

condition

Figure 10.

Thermal map in demagnetization

condition (1 Hz repetitive cycling on

48

Ω 1.2 H load)

AM01851v1

AM01852v1