Thermal measurements

AN2838

14/23

DocID15099 Rev 2

4

Thermal measurements

To check the reliability of the design, thermal mapping by means of an IR camera was

carried out. Figure 20 and Figure 21 show thermal measurements on the component side of

the board at nominal input voltages and full load. Some pointers visible on the pictures

placed across key components show the relevant temperature. Table 1 provides the

correlation between the measured points and components, for both thermal maps. The

ambient temperature during both measurements was 27 °C. According to these

measurement results, all components on the board function within their temperature limits.

load

load

Component

MOSFET Q1

57.8 °C

43.8 °C

Secondary diode D5

58.9 °C

58.1 °C

Diode bridge D1

65.9 °C

45.6 °C

Transformer TR1 (bobbin)

64.3 °C

65.1 °C

Transformer TR1 (core)

54.5 °C

55 °C

Choke T1

55.7 °C

36. 2 °C

Choke T2

56 °C

38.2 °C

Transil D2

70 °C

59 °C