6

685fa

LT685

TYPICAL PERFOR A CE CHARACTERISTICS

PACKAGE DESCRIPTIO

H Package

10-Lead TO-5 Metal Can

(Reference LTC DWG # 05-08-1322)

OBSOLETE PACKAGE

Propagation Delays as a Function

of Temperature

Hysteresis as a Function of

Temperature

TEMPERATURE (°C)

–50

2

6

12

0

50

75

LTC685 • TPC01

4

10

8

–25

25

100

125

TEMPERATURE (°C)

–50

0

40

100

0

50

75

LTC685 • TPC02

20

80

60

10

50

30

90

70

–25

25

100

125

R = 200Ω

R = 500Ω

R = 1000Ω

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.230

( 5.842)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.028 – 0.034

(0.711 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

36°BSC

H10(TO-5) 1197

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

PIN 1