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LTC3429B Datasheet(PDF) 8 Page - Linear Technology |
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LTC3429B Datasheet(HTML) 8 Page - Linear Technology |
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8 / 12 page ![]() LTC3429/LTC3429B 8 3429fa APPLICATIO S I FOR ATIO is achieved by terminating the switching of the synchro- nous PMOS and applying VIN statically on its gate. This ensures that the slope of the inductor current will reverse during the time current is flowing to the output. Since the PMOS no longer acts as a low impedance switch in this mode, there will be more power dissipation within the IC. This will cause a sharp drop in the efficiency (see Typical Performance Characteristics, Efficiency vs VIN). The maxi- mum output current should be limited in order to maintain an acceptable junction temperature. OPERATIO PCB LAYOUT GUIDELINES The high speed operation of the LTC3429/LTC3429B demands careful attention to board layout. You will not get advertised performance with careless layout. Figure 2 shows the recommended component placement. A large ground pin copper area will help to lower the chip tempera- ture. A multilayer board with a separate ground plane is ideal, but not absolutely necessary. inductor ripple current. Increasing the inductance above 10µH will increase size while providing little improvement in output current capability. The approximate output current capability of the LTC3429 versus inductance value is given in the equation below and illustrated graphically in Figure 3. II VD fL D OUT MAX P IN () •– • •• •– = ⎛ ⎝ ⎜ ⎞ ⎠ ⎟ () η 2 1 where: η = estimated efficiency IP = peak current limit value (0.6A) VIN = input (battery) voltage D = steady-state duty ratio = (VOUT – VIN)/VOUT f = switching frequency (500kHz typical) L = inductance value INDUCTANCE (µH) 3 120 160 200 19 3429 F03 80 40 100 140 180 60 20 0 7 5 11 9 15 17 21 13 23 VIN = 1.2V VOUT = 3.3V VOUT = 5V Figure 3. Maximum Output Current vs Inductance Based on 90% Efficiency SW GND FB 1 2 3 6 5 4 VIN VOUT SHDN SHDN 3429 F02 VOUT VIN RECOMMENDED COMPONENT PLACEMENT. TRACES CARRYING HIGH CURRENT ARE DIRECT. TRACE AREA AT FB PIN IS SMALL. LEAD LENGTH TO BATTERY IS SHORT Figure 2. Recommended Component Placement for Single Layer Board COMPONENT SELECTION Inductor Selection The LTC3429/LTC3429B can utilize small surface mount and chip inductors due to its fast 500kHz switching frequency. Typically, a 4.7µH inductor is recommended for most applications. Larger values of inductance will allow greater output current capability by reducing the |
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