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D6461 Datasheet(PDF) 57 Page - NEC

Part # D6461
Description  CMOS LSI CHIP FOR CAMCORDER ON-SCREEN CHARACTER DISPLAY 12 ROWS x 24 COLUMNS
PDF  60 Pages
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

D6461 Datasheet(HTML) 57 Page - NEC

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µPD6461, 6462
9. RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface Mount Devices
µPD6461GS-xxx: 20-pin plastic shrink SOP (300 mil)
µPD6461GT-xxx: 24-pin plastic SOP (375 mil)
µPD6462GS-xxx: 20-pin plastic shrink SOP (300 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°C or below (Package surface temperature),
IR35-00-2
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 2 times.
Vapor phase soldering
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-2
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 2 times.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°C or below (Package surface temperature).
Partial heating method
Pin temperature: 300
°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.



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