µPD16650

11

RECOMMENDED MOUNTING CONDITIONS

When mounting this product, please make sure that the following recommended conditions are satisfied.

For packaging methods and conditions other than those recommended below, please contact NEC sales

personnel.

µPD16650N-×××

Mounting Condition

Mounting Method

Thermocompression

Soldering

ACF (Sheet-shape bonding

agent)

Caution

To find out the detailed conditions for packaging the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more packaging methods at a time.

Reference

NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)

Quality Grades to NEC’s Semiconductor Devices (IEI-1209)

Condition

Heating tool 300 to 350 ˚C; heating for 2 to 3 seconds; pressure 100 g

(per solder)

secs.

secs. (when using the anisotropic conductive film SUMIZAC1003 of

Sumitomo Bakelite, Ltd.)