- Low power loss, high current capability, low VF

- Surface mount device type

- Moisture sensitivity level 1

- Matte Tin (Sn) lead finish with Nickel (Ni) underplate

- Packing code with suffix "G" means

green compound (halogen-free)

- Case: Bend lead SOD-123 small outline plastic package

- Polarity: Indicated by cathode band

- Weight: 0.01 g (approximately)

SYMBOL

UNIT

mW

V

V

mA

A

Notes: 1. Test Condition: 8.3ms single half sine-wave superimposed on rated load

Notes: 2. Valid provided that electrodes are kept at ambient temperature

SYMBOL

UNIT

pF

Document Number: DS_S1412004

Version: H14

Taiwan Semiconductor

Small Signal Product

Low VF SMD Schottky Barrier Diode

FEATURES

Thermal Resistance (Junction to Ambient)

(Note 2)

14

21

Repetitive Peak Reverse Voltage

Non-Repetitive Peak Forward Surge Current (Note 1)

solderable per MIL-STD-202, Method 208 guaranteed

- High temperature soldering guaranteed : 260°C/10s

0.375

30

-

PARAMETER

Reverse Breakdown Voltage

(Minimum Value)

40

-

Reverse Voltage

-

-

0.620

Forward Voltage

(Maximum Value)

B0520LW,B0530W,B0540W

Junction and Storage Temperature Range

Power Dissipation

PARAMETER

B0520LW

B0530W

B0540W

SOD-123

MECHANICAL DATA

- Terminal: Matte tin plated, lead free,

V

B0520LW

B0530W

B0540W

-

410

5.5

500

20

V

μA

28

40

30

20

-55 to +125

244

10

-

-

--

-

0.385

0.430

0.510

-

75

-

--

20

-

20

-

250

-

Junction Capacitance

f=1.0MHz

-

0.300

170

Reverse Leakage Current

(Maximum Value)

130