CREAT BY ART

- Glass passivated junction chip

- Ideal for automated placement

- Super fast recovery time for high efficiency

- Built-in strain rellef

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix "G" on packing code - Green compound (halogen-free)

Base P/N with prefix "H" on packing code - AEC-Q101 qualified

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix "H" on packing code meet JESD 201 class 2 whisker test

50

100

150

200

300

400

500

600

V

35

70

105

140

210

280

350

420

V

50

100

150

200

300

400

500

600

V

A

Trr

ns

Cj

pF

Document Number: DS_D1405052

Version:J14

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

MECHANICAL DATA

Case:

DO-214AC (SMA)

DO-214AC (SMA)

ES1A thru ES1J

Taiwan Semiconductor

Surface Mount Super Fast Rectifiers

FEATURES

- Moisture sensitivity level: level 1, per J-STD-020

Polarity:

Indicated by cathode band

Weight:

0.06 g (approximately)

PARAMETER

SYMBOL

ES

1A

ES

1B

ES

1C

ES

1D

ES

1F

ES

1G

ES

1H

ES

1J

UNIT

Maximum repetitive peak reverse voltage

Maximum RMS voltage

18

Maximum DC blocking voltage

Maximum average forward rectified current

1

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

30

A

Maximum instantaneous forward voltage (Note 1)

@ 1 A

V

35

Operating junction temperature range

Storage temperature range

- 55 to +150

- 55 to +150

Typical junction capacitance (Note 3)

Typical thermal resistance

35

85

16

μA

Note 1: Pulse test with PW=300μs, 1% duty cycle

0.95

1.3

1.7

5

100

Maximum reverse recovery time (Note 2)