CREAT BY ART

- Glass passivated chip junction

- High current capability, Low VF

- High reliability

- High surge current capability

- Low power loss

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix "G" on packing code - green compound (halogen-free)

Base P/N with prefix "H" on packing code - AEC-Q101 qualified

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix "H" on packing code meet JESD 201 class 2 whisker test

50

100

150

200

300

400

500

600

V

35

70

105

140

210

280

350

420

V

50

100

150

200

300

400

500

600

V

A

Trr

ns

Cj

pF

Note 1: Pulse Test with PW=300μs, 1% Duty Cycle

Document Number: DS_D1405024

Version: G14

SF31G thru SF38G

Taiwan Semiconductor

Glass Passivated Super Fast Rectifiers

FEATURES

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

UNIT

MECHANICAL DATA

Case:

DO-201AD

DO-201AD

Weight:

1.1 g (approximately)

PARAMETER

SYMBOL

SF

31G

SF

32G

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

125

SF

34G

SF

35G

SF

36G

SF

37G

SF

38G

SF

33G

A

Maximum instantaneous forward voltage (Note 1)

@ 3 A

0.95

V

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

3

5

μA

100

Maximum reverse recovery time (Note 2)

Operating junction temperature range

- 55 to +150

Storage temperature range

- 55 to +150

Typical junction capacitance (Note 3)

Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.

1.3

1.7

35

80

60

Typical thermal resistance

9

10

35