15

LTC1061

PACKAGE DESCRIPTIO

N Package

20-Lead Plastic DIP

J Package

20-Lead Ceramic DIP

S Package

20-Lead Plastic SOL

0.015

(0.381)

MIN

0.125

(3.175)

MIN

0.130 ± 0.005

(3.302 ± 0.127)

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.018 ± 0.003

(0.457 ± 0.076)

0.065 ± 0.015

(1.651 ± 0.381)

0.100 ± 0.010

(2.540 ± 0.254)

0.260 ± 0.010

(6.604 ± 0.254)

1.040

(26.416)

MAX

12

3

4

5

6

7

8

910

19

11

12

13

14

16

15

17

18

20

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.325

(7.620 – 8.255)

0.325

+0.025

–0.015

+0.635

–0.381

8.255

()

3

7

56

10

9

1

4

2

8

11

20

16

15

17

14

13

12

19

18

0.005

(0.127)

MIN

0.025

(0.635)

RAD TYP

0.220 – 0.310

(5.588 – 7.874)

1.060

(26.924)

MAX

0.290 – 0.320

(7.366 – 8.128)

0° – 15°

0.008 – 0.018

(0.203 – 0.457)

0.385 ± 0.025

(9.779 ± 0.635)

0.015 – 0.060

(0.381 – 1.524)

0.160

(4.064)

MAX

0.125

(3.175)

MIN

0.080

(2.032)

TYP

0.014 – 0.026

(0.356 – 0.660)

0.038 – 0.068

(0.965 – 1.727)

0.100 ± 0.010

(2.540 ± 0.254)

0.200

(5.080)

MAX

NOTE:

PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.

THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS.

SEE NOTE

0.496 – 0.512

(12.598 – 13.005)

20

19

18

17

16

15

14

13

1

23

4

5

6

78

0.394 – 0.419

(10.007 – 10.643)

910

11

12

0.037 – 0.045

(0.940 – 1.143)

0.004 – 0.012

(0.102 – 0.305)

0.093 – 0.104

(2.362 – 2.642)

0.050

(1.270)

TYP

0.014 – 0.019

(0.356 – 0.482)

TYP

0° – 8° TYP

SEE NOTE

0.009 – 0.013

(0.229 – 0.330)

0.016 – 0.050

(0.406 – 1.270)

0.291 – 0.299

(7.391 – 7.595)

× 45°

0.010 – 0.029

(0.254 – 0.737)

0.005

(0.127)

RAD MIN

Dimensions in inches (millimeters) unless otherwise noted.

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.