23

LTC1273

LTC1275/LTC1276

N Package

24-Lead Plastic DIP

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

NOTE 1

0.598 – 0.614

(15.190 – 15.600)

(NOTE 2)

22

21

20

19

18

17

16

15

1

23

4

5

6

78

0.394 – 0.419

(10.007 – 10.643)

910

13

14

11

12

23

24

0.037 – 0.045

(0.940 – 1.143)

0.004 – 0.012

(0.102 – 0.305)

0.093 – 0.104

(2.362 – 2.642)

0.050

(1.270)

TYP

0.014 – 0.019

(0.356 – 0.482)

0° – 8° TYP

NOTE 1

0.009 – 0.013

(0.229 – 0.330)

0.016 – 0.050

(0.406 – 1.270)

0.291 – 0.299

(7.391 – 7.595)

(NOTE 2)

× 45°

0.010 – 0.029

(0.254 – 0.737)

0.005

(0.127)

RAD MIN

NOTE:

1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.

THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS.

2. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).

S Package

24-Lead Plastic SOL

0.260 ± 0.010

(6.604 ± 0.254)

1.265

(32.131)

12

3

4

5

6

7

89

10

19

11

12

13

14

16

15

17

18

20

21

22

23

24

0.015

(0.381)

MIN

0.125

(3.175)

MIN

0.130 ± 0.005

(3.302 ± 0.127)

0.065

(1.651)

TYP

0.045 – 0.065

(1.143 – 1.651)

0.018 ± 0.003

(0.457 ± 0.076)

0.050 – 0.085

(1.27 – 2.159)

0.100 ± 0.010

(2.540 ± 0.254)

0.009 – 0.015

(0.229 – 0.381)

0.300 – 0.325

(7.620 – 8.255)

0.325

+0.025

–0.015

+0.635

–0.381

8.255

()

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.