µPD77016

8

CONTENTS

1.

PIN FUNCTIONS ...............................................................................................................................

9

1.1

Pin Functions ...........................................................................................................................................

9

1.2

Recommended Connection for Unused Pins .......................................................................................14

2.

FUNCTIONS ...................................................................................................................................... 15

2.1

Pipeline Processing ................................................................................................................................ 15

2.1.1

Outline ........................................................................................................................................... 15

2.1.2

Instructions with Delay .................................................................................................................. 15

2.2

Program Control Unit .............................................................................................................................. 16

2.3

Operation Unit ......................................................................................................................................... 16

2.3.1

General register (R0 to R7) ........................................................................................................... 16

2.3.2

MAC: Multiply ACcumulator ......................................................................................................... 17

2.3.3

ALU: Arithmetic Logic Unit ........................................................................................................... 17

2.3.4

BSFT: Barrel ShiFTer ................................................................................................................... 17

2.3.5

SAC: Shifter And Count Circuit .................................................................................................... 17

2.3.6

CJC: Condition Judge Circuit ....................................................................................................... 17

2.4

Memory ..................................................................................................................................................... 18

2.4.1

Instruction RAM Outline ................................................................................................................ 19

2.4.2

Data Memory Outline .................................................................................................................... 19

2.4.3

Data Memory Addressing .............................................................................................................. 19

2.5

On-chip Peripheral Circuit ...................................................................................................................... 20

2.5.1

Serial Interface Outline .................................................................................................................. 20

2.5.2

Host Interface Outline .................................................................................................................... 20

2.5.3

General Input/output Ports Outline ................................................................................................ 20

2.5.4

Wait Cycle Register ....................................................................................................................... 20

3.

INSTRUCTIONS ................................................................................................................................ 21

3.1

Outline ...................................................................................................................................................... 21

3.2

Instruction Set and Operation ................................................................................................................ 22

4.

ELECTRICAL SPECIFICATIONS .....................................................................................................29

5.

PACKAGE DRAWING ...................................................................................................................... 50

6.

RECOMMENDED SOLDERING CONDITIONS ................................................................................ 51