µPD7759

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4. RECOMMENDED SOLDERING CONDITIONS

The following conditions (see tables below) must be met when soldering the

µPD7759. Please consult

with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY

MANUAL" (IEI-1207).

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Soldering Process

Soldering Conditions

Symbol

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below,

Temperature of pre-heat: 120

°C or below (Plastic surface temperature),

Number of flow process: 1

Peak package's surface temperature: 230

°C or below,

Infrared Ray Reflow

Reflow time: 30 seconds or below (210

°C or higher),

IR30-00-1

Number of reflow process: 1

Peak package's temperature: 215

°C or below,

VPS

Reflow time: 40 seconds or below (200

°C or higher),

VP15-00-1

Number of reflow process: 1

Terminal temperature: 300

°C or below,

Time: 3 seconds or below (Per one side of the device)

Caution Do not apply more than one soldering method at any one time, except for "Partial heating method".

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µPD7759C:40-pin plastic DIP (600mil)

Soldering Process

Soldering Conditions

Wave Soldering

Solder Temperature: 260

°C or below

(only lead part)

Flow time: 10 seconds or below

Terminal temperature: 260

°C or below

Time: 10 seconds or below

Caution Do not jet molten solder on the surface of package.

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Partial Heating Method

—

Wave Soldering

WS60-00-1

Partial Heating Method