RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140820

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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RFAM3790

Evaluation Board Assembly Drawing

Note:

The ground plane of the RFAM3790 module should be soldered onto a board equipped with as many thermal vias as possible.

Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC

power. In any case the module backside temperature should not exceed 100°C.

D1

D4

D3

D2

EVALUATION-BOARD RFAM2790 ED A533

C4

C8

R1

C7

C1

C2

C3

C6

Fb1

C5

C9

TR3

TR2

TR1

ADJUST

J1

J2

V+

POWER

ENABLE

ATT

GND

RF_OUT

RF_IN

RFAM3790PCBA-410