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ZXMN2A01FTC Datasheet(PDF) 3 Page - Diodes Incorporated

Part # ZXMN2A01FTC
Description  20V N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  7 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXMN2A01FTC Datasheet(HTML) 3 Page - Diodes Incorporated

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ZXMN2A01F
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
20
V
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
1
µA
VDS = 20V, VGS = 0V
Gate-Body Leakage
IGSS
100
nA
VGS = ±12V, VDS = 0V
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
0.7
V
VDS = VGS, ID = 250µA
Static Drain-Source On-Resistance (Note 8)
RDS(ON)
0.12
Ω
VGS = 4.5V, ID = 4A
0.225
Ω
VGS = 2.5V, ID = 1.5A
Forward Transconductance
gFS
6.1
S
VDS = 10V, ID = 4A
Diode Forward Voltage (Note 8 & 10)
VSD
0.85
0.95
V
VGS = 0V, IS = 3.2A, TJ = +25°C
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Ciss
303
pF
VDS = 15V, VGS = 0V,
f = 1MHz
Output Capacitance
Coss
59
Reverse Transfer Capacitance
Crss
30
Total Gate Charge (Note 9)
Qg
3.0
nC
VDS = 10V, VGS = 10V,
ID = 4A
Gate-Source Charge (Note 9)
Qgs
0.8
Gate-Drain Charge (Note 9)
Qgd
1.0
Turn-On Delay Time (Note 9)
tD(on)
2.49
ns
VDD = 10V , ID =4A,
RG = 6
Ω, V
GS = 5V
Turn-On Rise Time (Note 9)
tr
5.21
Turn-Off Delay Time (Note 9)
tD(off)
7.47
Turn-Off Fall Time (Note 9)
tf
4.62
Reverse Recovery Time
trr
23
ns
TJ = +25°C, IF = 4A, di/dt= 100A/µs
Reverse Recovery Charge
Qrr
5.65
nC
Notes:
8.
Measured under pulsed conditions. Width=300μs. Duty cycle
≦2%.
9. Switching characteristics are independent of operating junction temperature.
10. Guaranteed by design. Not subject to production testing.
ZXMN2A01F
Document number: DS33513 Rev. 4 - 2
3 of 7
www.diodes.com
August 2014
© Diodes Incorporated



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