SGA4563Z datasheet(4/6 Pages) RFMD

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SGA4563Z

SOT-363 PCB Pad Layout

SOT-363 Nominal Package Dimensions

Function

Description

3RF IN

RF input pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency of operation.

1, 2,

4, 5

GND

Connection to ground. For optimum RF performance, use via holes as close to ground leads as possible to reduce lead

inductance.

6RF OUT/BIAS RF output and bias pin. DC voltage is present on this pin, therefor a DC-blocking capacitor is necessary for proper opera-

tion.

Preliminary

Dimensions in inches [millimeters]

OUT

I N

Notes:

1. Provide a large ground pad area under device

pins 1, 2, 4, & 5 with many plated via holes as

shown.

2. Dimensions given for 50 Ohm RF I/O lines are for

31 mil thick Getek. Scale accordingly for different

board thicknesses and dielectric contants.

3. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.

SGA4563Z Datasheet(PDF) 4 Page - RF Micro Devices