IRGS/B/P4630D/EPbF

7

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November 18, 2014

Fig. 26 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)

Fig. 27 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)

1E-006

1E-005

0.0001

0.001

0.01

0.1

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

1

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthjc + Tc

1E-006

1E-005

0.0001

0.001

0.01

0.1

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

1

10

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthjc + Tc

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

τ

C

τ

C

Ci=

τi/Ri

Ci=

τi/Ri

Ri (°C/W)

0.244

0.000084

1.102

0.001770

0.655

0.013544

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

R

1

R

1

R

2

R

2

τ

C

τ

C

Ci=

τi/Ri

Ci=

τi/Ri

Ri (°C/W)

0.3193

0.000273

0.4104

0.004525

Notes:









Pulse width limited by maximum junction temperature.



Values influenced by parasitic L and C in measurement.



When mounted on 1” square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application

note #AN-994.http://www.irf.com/technical-info/appnotes/an-994.pdf