NICHIA STS-DA1-3555 <Cat.No.150227>

6

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

● Recommended Soldering Pad Pattern

(単位 Unit: mm)

0.5

0.4

0.5

4.1

1.3

* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,

Nichia cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.

* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,

caused by heat and/or atmosphere.

* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.

Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.

When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress

to the encapsulation of the LEDs.

Recommended conditions:

Using a nozzle designed for the LEDs is recommended. (See Figure below)

* The nozzle must not have any direct contact with the encapsulating resin.

Direct contact with the encapsulating resin may result in internal disconnections causing the LED not to illuminate.

(単位 Unit: mm)

A部拡大

Expansion of A

0.15

4.5

A

Φ

3.5

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec