NICHIA STS-DA1-2853F <Cat.No.150622>

8

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec

● Recommended Soldering Pad Pattern

● Recommended Metal Solder Stencil Aperture

Die Heat Sink and the cathode should be soldered to a PCB.

* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,

Nichia cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.

* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,

caused by heat and/or atmosphere.

* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.

Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.

When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress

to the encapsulation of the LEDs.

Recommended conditions:

Using a nozzle designed for the LEDs is recommended. (See Figure below)

* The nozzle must not have any direct contact with the encapsulating resin.

Direct contact with the encapsulating resin may result in internal disconnections causing the LED not to illuminate.