MAX3228EBV datasheet(2/14 Pages) MAXIM

2 / 14 page

+2.5V to +5.5V RS-232 Transceivers

in UCSP

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC to GND ...........................................................-0.3V to +6.0V

V+ to GND .............................................................-0.3V to +7.0V

V- to GND ..............................................................+0.3V to -7.0V

V+ to |V-| (Note 1) ................................................................+13V

VL to GND..............................................................-0.3V to +6.0V

Input Voltages

T_IN, FORCEON, FORCEOFF to GND .......-0.3V to (VL + 0.3V)

R_IN to GND .....................................................................±25V

Output Voltages

T_OUT to GND ...............................................................±13.2V

R_OUT to GND ...........................................-0.3V to (VL + 0.3V)

INVALID to GND......................................-0.3V to (VCC + 0.3V)

Short-Circuit Duration T_OUT to GND........................Continuous

Continuous Power Dissipation (TA = +70°C)

6 ✕ 5 UCSP (derate 10.1mW/°C above TA = +70°C) ...805mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Bump Temperature (Soldering) (Note 2)

Infrared (15s) ...............................................................+200°C

Vapor Phase (20s) .......................................................+215°C

ELECTRICAL CHARACTERISTICS

(VCC = +2.5V to +5.5V, VL = +1.65V to +5.5V, C1–C4 = 0.1µF, tested at +3.3V ±10%, TA = TMIN to TMAX. Typical values are at TA =

+25°C, unless otherwise noted.) (Note 3)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

VL Input Voltage Range

1.65

VCC + 0.3

FORCEON = GND

FORCEOFF = VL, all RIN open

µA

FORCEOFF = GND

µA

VCC Supply Current,

AutoShutdown

ICC

FORCEON,

FORCEOFF floating

VCC Supply Current,

AutoShutdown Disabled

ICC

FORCEON =

FORCEOFF = VL

no load

0.3

FORCEON or

FORCEOFF = GND, VCC =

VL = +5v

VL Supply Current

FORCEON,

FORCEOFF floating

µA

LOGIC INPUTS

Pullup Currents

FORCEON,

FORCEOFF to VL

µA

Input Logic Low

T_IN, FORCEON,

FORCEOFF

0.4

Input Logic High

T_IN, FORCEON,

FORCEOFF

0.66 ✕ VL

Transmitter Input Hysteresis

0.5

Input Leakage Current

T_IN

±0.01

±1

µA

RECEIVER OUTPUTS

Output Leakage Currents

R_OUT, receivers disabled,

FORCEOFF =

GND or in AutoShutdown

±10

µA

Output Voltage Low

IOUT = 0.8mA

0.4

Output Voltage High

IOUT = -0.5mA

VL - 0.4 VL - 0.1

Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Pre-

heating is required. Hand or wave soldering is not allowed.

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