IRFN9240

2

www.irf.com

Thermal Resistance

Parameter

Min Typ Max

Units

Test Conditions

RthJC

Junction to Case

—

—

1.0

RthJ-PCB

Junction to PC Board

—

4.0

—

Soldered to a copper-clad PC board

°C/W

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ

Max Units

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

-11

ISM

Pulse Source Current (Body Diode) ➀

—

—

-44

VSD

Diode Forward Voltage

—

—

-4.6

V

trr

Reverse Recovery Time

—

—

440

nS

Tj = 25°C, IF = -11A, di/dt ≤-100A/µs

QRR Reverse Recovery Charge

—

—

7.2

µc

VDD ≤ -30V ➃

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

A

For footnotes refer to the last page

Parameter

Min

Typ Max Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

-200

—

—

V

VGS = 0V, ID = -1.0mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown

—

-0.2

—

V/°C

Reference to 25°C, ID = -1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

—

—

0.51

VGS = -10V, ID = -7.0A➃

Resistance

—

—

0.52

VGS = -10V, ID = -11A ➃

VGS(th)

Gate Threshold Voltage

-2.0

—

-4.0

V

VDS = VGS, ID = -250µA

gfs

Forward Transconductance

4.0

—

—

S ( )

VDS > -15V, IDS = -7.0A➃

IDSS

Zero Gate Voltage Drain Current

—

—

-25

VDS= -160V, VGS= 0V

—

—

-250

VDS = -160V

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

-100

VGS = -20V

IGSS

Gate-to-Source Leakage Reverse

—

—

100

VGS =20V

Qg

Total Gate Charge

—

—

60

VGS = -10V, ID= -11A

Qgs

Gate-to-Source Charge

—

—

15

nC

VDS = -100V

Qgd

Gate-to-Drain (‘Miller’) Charge

—

—

38

Turn-On Delay Time

—

—

35

VDD = -100V, ID = -11A,

tr

Rise Time

—

—

85

RG =9.1Ω, VGS = -10V

Turn-Off Delay Time

—

—

85

tf

Fall Time

—

—

65

LS + LD

Total Inductance

—

4.0

—

Ciss

Input Capacitance

—

1200

VGS = 0V, VDS = -25V

Coss

Output Capacitance

—

570

—

pF

f = 1.0MHz

Crss

Reverse Transfer Capacitance

—

81

—

nA

nH

ns

µA

Ω

Measured from the center of

drain pad to center of source

pad