TPS799

SBVS056K – JANUARY 2005 – REVISED JANUARY 2015

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Table of Contents

7.4

Device Functional Modes........................................ 13

1

Features .................................................................. 1

8

Application and Implementation ........................ 14

2

Applications ........................................................... 1

8.1

Application Information............................................ 14

3

Description ............................................................. 1

8.2

Typical Applications ................................................ 14

4

Revision History..................................................... 2

8.3

Do's and Don'ts ...................................................... 16

5

Pin Configuration and Functions ......................... 3

9

Power Supply Recommendations ...................... 16

5.1

Fixed Voltage Versions ............................................. 3

10

Layout................................................................... 16

5.2

Adjustable Voltage Versions ..................................... 3

10.1

Layout Guidelines ................................................. 16

6

Specifications......................................................... 5

10.2

Layout Example .................................................... 17

6.1

Absolute Maximum Ratings ...................................... 5

10.3

Thermal Information .............................................. 17

6.2

ESD Ratings ............................................................ 5

11

Device and Documentation Support ................. 18

6.3

Recommended Operating Conditions ....................... 5

11.1

Device Support...................................................... 18

6.4

Thermal Information .................................................. 5

11.2

Documentation Support ........................................ 18

6.5

Electrical Characteristics........................................... 6

11.3

Trademarks ........................................................... 18

6.6

Typical Characteristics .............................................. 7

11.4

Electrostatic Discharge Caution ............................ 18

7

Detailed Description ............................................ 12

11.5

Glossary ................................................................ 18

7.1

Overview ................................................................. 12

12

Mechanical, Packaging, and Orderable

7.2

Functional Block Diagram ....................................... 12

Information ........................................................... 18

7.3

Feature Description................................................. 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision J (August 2010) to Revision K

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Changed Features list ........................................................................................................................................................... 1

•

Changed Description section.................................................................................................................................................. 1

•

Changed figure on front page; replaced device pinouts with application circuits................................................................... 1

•

Changed Pin Configuration and Functions section; updated table format, renamed pin packages to meet new

standards ............................................................................................................................................................................... 3

•

Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum Ratings .................................. 5

•

Changed free-air to junction in Recommended Operating Conditions table conditions......................................................... 5

•

Added thermal information for additional device packages ................................................................................................... 5

Changes from Revision I (November 2007) to Revision J

Page

•

Replaced the Dissipation Ratings table with the Thermal Information table .......................................................................... 5

2

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