3.3V/5V/Adjustable-Output

Step-Up DC-DC Converters

3.3V/5V/Adjustable-Output,

Step-Up DC-DC Converters

GND

GND

LBI

OUT

3/5 (MAX756)

FB (MAX757)

REF

SHDN

LX

LBO

0.122"

(3.10mm)

0.080"

(2.03mm)

___________________Chip Topography

________________________________________________________Package Information

L

DIM

A

A1

B

C

D

E

e

H

h

L

α

MIN

0.053

0.004

0.014

0.007

0.189

0.150

0.228

0.010

0.016

0˚

MAX

0.069

0.010

0.019

0.010

0.197

0.157

0.244

0.020

0.050

8˚

MIN

1.35

0.10

0.35

0.19

4.80

3.80

5.80

0.25

0.40

0˚

MAX

1.75

0.25

0.49

0.25

5.00

4.00

6.20

0.50

1.27

8˚

INCHES

MILLIMETERS

α

8-PIN PLASTIC

SMALL-OUTLINE

PACKAGE

H

E

D

e

A

A1

C

h x 45˚

0.127mm

0.004in.

B

1.27 BSC

0.050 BSC

21-325A

PC Layout and Grounding

The MAX756/MAX757 high peak currents and high-fre-

quency operation make PC layout important for mini-

mizing ground bounce and noise. The distance

between the MAX756/MAX757’s GND pin and the

ground leads of C1 and C2 in Figure 1 must be kept to

less than 0.2" (5mm). All connections to the FB and LX

pins should also be kept as short as possible. To

obtain maximum output power and efficiency and mini-

mum output ripple voltage, use a ground plane and

solder the MAX756/MAX757 GND (pin 7) directly to the

ground plane.

TRANSISTOR COUNT: 758

SUBSTRATE CONNECTED TO OUT

8

_______________________________________________________________________________________