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PLCC4XRGBCT Datasheet(PDF) 7 Page - HB Electronic Components

Part # PLCC4XRGBCT
Description  High luminous Intensity
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  HB [HB Electronic Components]
Direct Link  http://www.hebeiltd.com.cn
Logo HB - HB Electronic Components

PLCC4XRGBCT Datasheet(HTML) 7 Page - HB Electronic Components

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Reflow Soldering
Hand Soldering
Profile Feature
Lead Solder
Lead-free Solder
Temperature
Soldering time
350 ℃ max.
3 seconds max.
(one time only)
Pre-heat temperature
(Tsmin to Tsmax)
120~150 ℃
180~200 ℃
Pre-heat time
(Tsmin to Tsmax)
60-120 seconds
60-120 seconds
Average ramp-up rate
(Tsmax to Tp)
3 ℃/second max.
3 ℃/second max.
Liquidous temperature
(TL)
183 ℃
217 ℃
Time at liquidous
(TL)
60-150 seconds
60-150 seconds
Peak package body
temperature(Tp)*
235~240 ℃ max.
255~260 ℃ max.
Classification
temperature(Tc)
240 ℃
260 ℃
Time(Tp)**within 5℃
of the specified
classification
temperature(Tc)
20**seconds
30**seconds
Average ramp-dawn
rate（Tp to Tsmax）
6 ℃/second max.
6 ℃/second max.
Time 25 ℃ to peak
temperature
6 minutes max.
8 minutes max.
Note:
1.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2.
** Tolerance for time at peak profile temperature (Tp) is defined as a supplier minimum and a user
maximum.
Technical Data Sheet
Top View LED
Hebei I.T. (Shanghai) Co., Lt
Part No: PLCC4XRGBCT
d.
www.ledz.com
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