BAT54

THRU

BAT54S

250mWatt, 30Volt

Schottky Barrier Diode

SOT-23

Suggested Solder

Pad Layout

Features

•

Low Forward Voltage

•

Surface Mount device

•

Very small conduction losses

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.110

.120

2.80

3.04

B

.083

.098

2.10

2.64

C

.047

.055

1.20

1.40

D

.035

.041

.89

1.03

E

.070

.081

1.78

2.05

F

.018

.024

.45

.60

G

.0005

.0039

.013

.100

H

.035

.044

.89

1.12

J

.003

.007

.085

.180

K

.015

.020

.37

.51

MCC

Catalog

Number

Device

Marking

Type

Pin

Configuration

Maximum Ratings

Continuos Reverse Voltage

30V

Electrical Characteristics @ 25 °C Unless Otherwise Specified

Ratings

Symbol

Max.

Notes

Forward Voltage at

240mV

320mV

400mV

500mV

900mV

Reverse Current

2.0 uA

Reverse Breakdown

Voltage

>30V

Capacitance

10pF

Measured at

Reverse Recovery

Time

5nS

Thermal Resistance,

Junction to Ambient

500K/W

.079

2.000

inches

mm

.031

.800

.035

.900

.037

.950

.037

.950

A

B

C

D

E

F

G

H

J

K

Forward Current

0.3A

omponents

21201 Itasca Street Chatsworth



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MCC

Non-Repetitive Peak Forward Current t<1s

1.0mA

°C

250mW

Storage Temperature Range

-55

°C to 150°C

Junction Temperature

150

°C

BAT54

L4P

Single

Figure 1

BAT54A

L42

Dual

Figure 2

BAT54C

L43

Dual

Figure 3

BAT54S

L44

Dual

Figure 4

(See Page 3)

Soldering temperature during 10s

260

°C