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MICRF003 Datasheet(PDF) 10 Page - Micrel Semiconductor

Part # MICRF003
Description  QwikRadiotm 900 MHz UHF Receiver Preliminary Information
PDF  16 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MICRF003 Datasheet(HTML) 10 Page - Micrel Semiconductor

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QwikRadio
tm
10
October 1999
MICRF003
MICRF003
Micrel
1. Selecting REFOSC Frequency Ft (FIXED Mode)
As with any superheterodyne receiver, the difference
between the (internal) Local Oscillator (LO) frequency Flo
and the incoming Transmit frequency Ftx must ideally equal
the IF Center frequency.
Equation (1) may be used to
compute the appropriate Flo for a given Ftx:
Flo = Ftx
± 2.496 * (Ftx / 915)
(1)
where Ftx and Flo are in MHz. Note that two values of Flo
exist for any given Ftx, distinguished as “high-side mixing”
and “low-side mixing”, and there is generally no preference
of one over the other.
After choosing one of the two acceptable values of Flo, use
equation (2) to compute the REFOSC frequency Ft:
Ft = Flo / 129.
(2)
Here Ft is in MHz. Connect a crystal of frequency Ft to the
REFOSC pin of the MICRF003. 4 decimal-place accuracy
on the frequency is generally adequate. The following table
identifies Ft for some common Transmit frequencies when
the MICRF003 is operated in FIXED mode.
Transmit Freq. Ftx (MHz)
REFOSC Freq. Ft (MHz)
868
915
6.7470
7.1124
2.
Selecting REFOSC Frequency Ft (SWP Mode)
Selection of REFOSC frequency Ft in SWP mode is much
simpler than in FIXED mode, due to the LO sweeping
process. Further, accuracy requirements of the frequency
reference component are significantly relaxed.
In SWP mode, Ft is given by equation (3):
Ft = Ftx / 128.5.
(3)
Connect a ceramic resonator of frequency Ft to the
REFOSC pin of the MICRF003. 2-decimal place accuracy
is generally adequate.
(A crystal may also be used if
desired, but may be necessary to reduce the Rx frequency
ambiguity if the Tx frequency ambiguity is excessive. See
Application Note TBD for further details.)
3. Selecting Capacitor CTH
First step in the process is selection of a Data Slicing Level
timeconstant.
This selection is strongly dependent on
system issues, like system decode response time and data
code structure (e.g., existance of data preamble, etc.). This
issue is too broad to discuss here, and the interested reader
should consult the Application Note TBD.
Source impedance of the CTH pin is given by equation (4),
where Ft is in MHz:
Rs = 90k
Ω * (6.75 / Ft).
(4)
Assuming that a Slicing Level Timeconstant TC has been
established, capacitor CTH may be computed using
equation (5):
CTH = TC / Rs.
(5)
4. Selecting CAGC Capacitor in Continuous Mode
Selection of CAGC in continuous mode is dictated by
minimizing the ripple on the AGC control voltage, by using a
sufficiently large capacitor.
It is Micrel’s experience that
CAGC should be in the vicinity of 0.47
µF to 4.7µF. Large
capacitor values should be carefully considered, as this
determines the time required for the AGC control voltage to
settle from a completely discharged condition. AGC settling
time from a completely discharged (0-volt) state is given
approximately by equation (6):
∆T = (1.333 * CAGC) – 0.44
(6)
where CAGC is in microfarads, and
∆T is in seconds.
5. Selecting CAGC Capacitor in Duty-Cycle Mode
Generally, droop of the AGC control voltage during
shutdown should be replenished as quickly as possible after
the IC is “turned-on”.
Recall from the section “AGC
Function and the CAGC Capacitor” that for about 10msec
after the IC is turned-on, the AGC push-pull currents are
increased to 45X their normal values.
So consideration
should be given to selecting a value for CAGC and a
shutdown time period such that the droop can be
replenished within this 10msec period.
Polarity of the droop is unknown, meaning the AGC voltage
could droop up or down.
Worst-case from a recovery
standpoint is downward droop, since the AGC pullup current
is 1/10
th magnitude of the pulldown current. The downward
droop is replenished according the the well-known equation
(7):
I / CAGC =
∆V / ∆T
(7)
where I = AGC Pullup current for initial 10msec (67.5
µA),
CAGC is the AGC capacitor value,
∆T = Droop recovery
time (<10msec), and
∆V is the droop voltage.
For example, if user desires
∆T = 10msec, and chooses a
4.7
µF CAGC, then the allowable droop is about 144mV.
Using the same equation with 200nA worst case pin
leakage and assuming 1uA of capacitor leakage in the
same direction, the maximum allowable
∆T (Shutdown
time) is about 0.56 seconds, for droop recovery in 10msec.



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