24C01SC-WF datasheet(8/12 Pages) MICROCHIP

8 / 12 page

24C01SC/02SC

DS21170A-page 8

Preliminary

8.0

PAD DESCRIPTIONS

8.1

SDA Serial Address/Data Input/Output

This is a bi-directional pad used to transfer addresses

and data into and data out of the device. It is an open

drain terminal, therefore the SDA bus requires a pull-up

resistor to VCC (typical 10K

Ω for 100 kHz, 1KΩ for 400

kHz).

For normal data transfer SDA is allowed to change only

during SCL low. Changes during SCL high are reserved

for indicating the START and STOP conditions.

8.2

SCL Serial Clock

This input is used to synchronize the data transfer from

and to the device.

8.3

DC Don’t Connect

This pad is used for test purposes and should not be

bonded out. It will be pulled to VSS through an internal

resistor.

9.0

DIE CHARACTERISTICS

Figure 9-1 shows the die layout of the 24C01SC/02SC,

including bondpad positions. Table 9-1 shows the

actual coordinates of the bondpad midpoints with

respect to the center of the die.

FIGURE 9-1:

DIE LAYOUT

TABLE 9-1:

BONDPAD COORDINATES

Pad Name

Pad Midpoint,

X dir.

Pad Midpoint,

Y dir.

VSS

-495.000

749.130

SDA

-605.875

-271.875

SCL

479.875

-746.625

VCC

605.875

-261.375

Note 1: Dimensions are in microns.

2: Center of die is at the 0,0 point.

DIP

SDA

VCC

SCL

VSS

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