LM2930 datasheet(2/13 Pages) TI

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LM2930

SNVS745D – APRIL 1998 – REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Input Voltage

Operating Range

26V

Overvoltage Protection

40V

Reverse Voltage (100 ms)

−12V

Reverse Voltage (DC)

−6V

Internal Power Dissipation (3)

Internally Limited

Operating Temperature Range

−40°C to +85°C

Maximum Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temp. (Soldering, 10 seconds)

230°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication

of device performance.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Thermal resistance without a heat sink for junction to case temperature is 3°C/W and for case to ambient temperature is 50°C/W for the

TO-220, 73°C/W for the SFM. If the SFM package is used, the thermal resistance can be reduced by increasing the P.C. board copper

area thermally connected to the package. Using 0.5 square inches of copper area,

θJA is 50°C/W; with 1 square inch of copper area, θJA

is 37°C/W; and with 1.6 or more square inches of copper area,

θJA is 32°C/W.

Electrical Characteristics

(1)

LM2930-5.0 VIN=14V, IO=150 mA, Tj=25°C

(2), C2=10 μF, unless otherwise specified

Parameter

Conditions

Typ

Tested

Design

Unit

Limit(3)

Limit(4)

Output Voltage

5.3

VMAX

4.7

VMIN

≤VIN≤26V, 5 mA≤IO≤150 mA

5.5

VMAX

−40°C≤TJ≤125°C

4.5

VMIN

Line Regulation

≤VIN≤16V, IO=5 mA

mVMAX

≤VIN≤26V, IO=5 mA

mVMAX

Load Regulation

5 mA

≤IO≤150 mA

mVMAX

Output Impedance

100 mADC & 10 mArms, 100 Hz−10 kHz

200

Quiescent Current

IO=10 mA

mAMAX

IO=150 mA

mAMAX

Output Noise Voltage

10 Hz

−100 kHz

140

μVrms

Long Term Stability

mV/1000 hr

Ripple Rejection

fO=120 Hz

Current Limit

400

700

mAMAX

150

mAMIN

Dropout Voltage

IO=150 mA

0.32

0.6

VMAX

Output Voltage Under

−12V≤VIN≤40V, RL=100Ω

5.5

VMAX

Transient Conditions

−0.3

VMIN

(1)

All characteristics are measured with a capacitor across the input of 0.1

μF and a capacitor across the output of 10 μF. All

characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tW≤10 ms, duty cycle≤5%). Output

voltage changes due to changes in internal temperature must be taken into account separately.

(2)

To ensure constant junction temperature, low duty cycle pulse testing is used.

(3)

Ensured and 100% production tested.

(4)

Ensured (but not 100% production tested) over the operating temperature and input current ranges. These limits are not used to

calculate outgoing quality levels.

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