LM9036 datasheet(2/15 Pages) TI

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LM9036

SNVS140E – AUGUST 2003 – REVISED MARCH 2013

www.ti.com

Figure 2. 8 Lead VSSOP

Figure 3. 8 Lead SOIC

Top View

LM9036MM-3.3, , LM9036MMX-3.3, LM9036MM-5.0,

LM9036M-3.3, LM9036MX-3.3, LM9036M-5.0,

LM9036MMX-5.0

LM9036MX-5.0

See NS Package Number DGK

See NS Package Number D

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Input Voltage (Survival)

+55V,

−45V

ESD Susceptibility(3)

±1.9kV

Power Dissipation(4)

Internally limited

Junction Temperature (TJmax)

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec.)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its specified operating ratings.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human body model, 100pF discharge through a 1.5k

Ω resistor.

(4)

The maximum power dissipation is a function of TJmax, θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM9036 will go

into thermal shutdown.

Operating Ratings

Operating Temperature Range

−40°C to +125°C

Maximum Input Voltage (Operational)

40V

SOIC-8 (D)

θJA

(1)

140°C/W

PFM (NDP0003B)

θJA

(1)

125°C/W

PFM (NDP0003B)

θJA

(2)

50°C/W

PFM (NDP0003B)

θJC

(1)

11°C/W

MSO-8 (DGK)

θJA

(1)

200°C/W

(1)

Worst case (Free Air) per EIA / JESD51-3.

(2)

Typical

θJA with 1 square inch of 2oz copper pad area directly under the ground tab.

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