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PCA9952 Datasheet(PDF) 39 Page - NXP Semiconductors |
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PCA9952 Datasheet(HTML) 39 Page - NXP Semiconductors |
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39 / 48 page ![]() PCA9952_PCA9955 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7.1 — 29 June 2015 39 of 48 NXP Semiconductors PCA9952; PCA9955 16-channel Fm+ I2C-bus 57 mA constant current LED driver 16. Package outline Fig 25. Package outline SOT1172-2 (HTSSOP28) References Outline version European projection Issue date IEC JEDEC JEITA SOT1172-2 - - - MO-153 - - - sot1172-2_po Unit mm max nom min 1.1 0.15 0.10 0.05 0.25 0.30 0.22 0.19 9.8 9.7 9.6 5.6 5.5 5.4 A Dimensions Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 A1 A2 0.95 0.90 0.85 A3 bp 0.75 0.62 0.50 0.40 0.37 0.3 0.2 Lp Qv c 0.20 0.15 0.10 D(1) Dh E(2) 4.5 4.4 4.3 Eh 2.3 2.2 2.1 e 0.65 1.0 6.6 6.4 6.2 HE L 0.1 0.80 0.63 0.50 8° 4° 0° yZ θ 0.13 w 0 2.5 5 mm scale y exposed die pad side D Dh Z bp w Eh e pin 1 index 14 1 28 15 detail X Q A A3 θ A1 A2 Lp L c X HE vA E A 10-07-06 10-07-13 |
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