9

8

7

6

10

2

3

4

5

1

Top View

Bottom View

Die-Attach

Pad (DAP)

GND

Die-Attach

Pad (DAP)

GND

2

3

4

5

1

9

8

7

6

10

SLEEP

C1+

C1-

SLEEP

C1+

C1-

EN

C2+

GND

C2-

EN

C2+

GND

C2-

LM2770

SNVS318E – NOVEMBER 2004 – REVISED MAY 2013

www.ti.com

DESCRIPTION (CONTINUED)

LM2770 efficiency is superior to both fixed-gain switched capacitor buck regulators and low-dropout linear

regulators (LDO's). Multiple fractional gains maximize power efficiency over the entire input voltage and output

current ranges. The LM2770 can also be switched into a low-power sleep mode when load currents are light (

≤

20mA). In sleep mode, the charge pump is off, and the output is driven with a low-noise, low-power linear

regulator.

Soft-start, short-circuit protection, current-limit protection, and thermal-shutdown protection are also included. The

LM2770 is available in TI’s small 10-pin Leadless Leadframe Package (WSON-10).

Connection Diagram

Figure 3. 10-Pin Non-Pullback Leadless Frame Package (WSON-10)

See Package Number DSC0010A

Pin Description

Pin #

Name

Description

1

Order Information for available voltage options)

2

EN

Enable Pin Logic Input. If high, part is enabled. If low, part is in shutdown.

3

C2+

Flying Capacitor 2: Positive Terminal

4

GND

Ground

5

C2-

Flying Capacitor 2: Negative terminal

10

SLEEP

Sleep Mode Logic Input. If high, the part operates in sleep mode, and the output is driven by a low power linear

regulator. If low, the part operates in full-power mode, and the output is driven by the switched capacitor regulator

9

8

C1+

Flying Capacitor 1: Positive Terminal

7

C1-

Flying Capacitor 1: Negative Terminal

6

Output Voltage

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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Product Folder Links: LM2770