low-stress applications that require a mid

to high thermally conductive interface

material.The highly conformable nature

of the material allows the pad to fill in air

voids and air gaps between PC boards

and heat sinks or metal chassis with

stepped topography, rough surfaces and

high stack-up tolerances.

natural tack on both sides of the material

allowing for stick-in-place characteristics

during application assembly.The material

is supplied with protective liners on both

sides.The top side has reduced tack for

ease of handling.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Power electronics DC/DC; 1/4, 1/2, full bricks, etc.

• Mass storage devices

• Graphics card/processor/ASIC

• Wireline/wireless communications hardware

• Automotive engine/transmission controls

CONFIGURATIONS AVAILABLE

• Sheet form and die-cut parts

PDS_GP_2000S40_0711

FEATURES AND BENEFITS

• Thermal conductivity: 2.0 W/m-K

• Low “S-Class” thermal resistance at very

low pressures

• Highly conformable, low hardness

• Designed for low-stress applications

• Fiberglass reinforced for puncture,

shear and tear resistance

PRODUCT DESCRIPTION

Highly Conformable,Thermally Conductive,

Reinforced “S-Class” Gap Filling Material

July 2011

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

Gray

Gray

Visual

Reinforcement Carrier

Fiberglass

Fiberglass

—

Thickness (inch) / (mm)

0.020 to 0.125

0.508 to 3.175

ASTM D374

Inherent Surface Tack (1 side)

2

2

—

Density (Bulk Rubber) (g/cc)

2.9

2.9

ASTM D792

Heat Capacity (J/g-K)

0.6

0.6

ASTM E1269

Hardness (BulkRubber) (Shore 00) (1)

30

30

ASTM D2240

Young's Modulus (psi) / (kPa) (2)

45

310

ASTM D575

Continuous Use Temp (°F) / (°C)

-76 to 392

-60 to 200

—

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

>5000

>5000

ASTM D149

Dielectric Constant (1000 Hz)

6.0

6.0

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L. 94

THERMAL

Thermal Conductivity (W/m-K)

2.0

2.0

ASTM D5470

THERMAL PERFORMANCE vs. STRAIN

Deflection (% strain)

10

20

30

0.97

0.89

0.80

1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min.step rate of strain

mal resistance. These values are provided for reference only. Actual application performance is directly related to the

surface roughness, flatness and pressure applied.

TYPICAL PROPERTIES OF GAP PAD 2000S40

0.20

0.50

1.50

1.00

2.00

2.50

125

100

75

50

25

0

Thickness vs. Thermal Resistance

Gap Pad 2000S40