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GP-2202SF Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part # GP-2202SF
Description  Silicone-free formulation
PDF  2 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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GP-2202SF Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

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Gap Pad® 2202SF is a high performance,
2.0 W/m-K, thermally conductive gap filling
material. The Gap Pad® 2202SF
compound is silicone-free by design and
offers exceptionally low interfacial
resistances to adjacent surfaces.
Gap Pad® 2202SF is specifically designed
for silicone-sensitive applications. The
material’s construction features a 0.5 mil
PET film on one side and natural tack on
the other. The natural tack eliminates the
need for an additional adhesive layer.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
Gap Pad® 2202SF
TYPICAL APPLICATIONS INCLUDE
• Hard drives
• Optical applications
• Set top boxes
CONFIGURATIONS AVAILABLE
• Sheet form
• We produce thousands of specials. Tooling charges vary depending
on tolerances and complexity of the part.
• Custom thicknesses available upon request
CONSTRUCTION
PDS_GP_2202SF_0814
FEATURES AND BENEFITS
• Thermal conductivity: 2.0 W/m-K
• Silicone-free formulation
• Minimal compression set
• 0.5 mil film provides tack-free surface
• Tacky side allows for ease of handling
and placement
PRODUCT DESCRIPTION
Silicone-Free Formulation, High Performance
Thermally Conductive Material
August 2014
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
Gray
Gray
Visual
Reinforcement Carrier
0.5 mil PET Film
0.5 mil PET Film
—
Thickness (inch) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
Inherent Surface Tack (1or 2 sided)
1
1
—
Density (g/cc)
2.8
2.8
ASTM D792
Hardness (Bulk Rubber) (Shore 00)1
70
70
ASTM D2240
Continuous Use Temp (°F) / (°C)
-40 to 257
-40 to 125
—
ELECTRICAL
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)2
2.0
2.0
ASTM D5470 3
1) Thirty second delay value at 250 mil, 23ºC. 2)This is the measured thermal conductivity of the Gap Pad Compound. 3) The ASTM
D5470 text fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for ref-
erence only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
TYPICAL PROPERTIES OF GAP PAD 2202SF
Overall
Thickness
Naturally Tacky
Gap Pad
3.0 mil Carrier Liner,
(Remove before use)
0.5 mil PET Film
(Do not remove)


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