LX1552/3/4/5

PRODUCT D A T ABOOK 1996/1997

Copyright © 1994

Rev. 1.0a 1/01

2

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Supply Voltage (Low Impedance Source) .................................................................. 30V

Supply Voltage (I

Output Current ............................................................................................................. ±1A

Output Energy (Capacitive Load) ................................................................................ 5µJ

Analog Inputs (Pins 2, 3) ........................................................................... -0.3V to +6.3V

Error Amp Output Sink Current ............................................................................... 10mA

Power Dissipation at T

Operating Junction Temperature

Ceramic (Y Package) ............................................................................................ 150°C

Plastic (M, DM, D, PW Packages) ........................................................................ 150°C

Storage Temperature Range .................................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C

PACKAGE PIN OUTS

V

REF

V

CC

OUTPUT

GND

COMP

V

FB

I

SENSE

R

1

8

27

36

45

M & Y PACKAGE

(Top View)

DM PACKAGE

(Top View)

V

REF

V

CC

OUTPUT

GND

COMP

V

FB

I

SENSE

R

1

8

27

36

45

V

REF

N.C.

V

CC

V

C

OUTPUT

GND

PWR GND

COMP

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

1

14

2

13

3

12

4

11

5

10

69

78

D PACKAGE

(Top View)

PW PACKAGE

(Top View)

1

20

2

19

3

18

4

17

5

16

6

15

7

14

8

13

9

12

10

11

N.C.

N.C.

COMP

V

FB

N.C.

I

SENSE

N.C.

R

N.C.

N.C.

N.C.

N.C.

V

REF

N.C.

V

CC

V

C

OUTPUT

GND

PWR GND

N.C.

M PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

95°C/W

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

165°C/W

D PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Y PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

130°C/W

PW PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

144°C/W

Junction Temperature Calculation:

T

J

= T

A

+ (P

D

x

θ

JA

).

The

θ

JA

numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow

THERMAL DATA

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect

to Ground. Currents are positive into, negative out of the specified terminal. Pin

numbers refer to DIL packages only.