LX1668

PRODUCT DA T ABOOK 1996/1997

Copyright © 1999

Rev. 1.0

4/99

2

12V Supply Voltage (V

5V Supply Voltage (V

Supply Voltage (Internal LDO)/(V

Output Drive Peak Current Source (500ns) ....................................................... 1.0A

Output Drive Peak Current Sink (500ns) ........................................................... 1.0A

Input Voltage (SS, VID[0:4]) ................................................................... -0.3V to 6V

Operating Junction Temperature .................................................................... 150°C

Storage Temperature Range ........................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) .................................................... 300°C

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with

respect to Ground. Currents are positive into, negative out of the specified

terminal.

Note 2. V

Voltages above

3.3V will cause increased thermal dissipation in the package. Power dissipation

should be limited to keep junction temperature below maximum rating.

DW PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

85°C/W

PW PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

110°C/W

Junction Temperature Calculation: T

The

θ

JA

numbers are guidelines for the thermal performance of the device/pc-board

system. All of the above assume no ambient airflow.

THERMAL DATA

ABSOLUTE MAXIMUM RATINGS

(Note 1 & 2)

PACKAGE PIN OUTS

PW PACKAGE — 20-Pin

(Top View)

PGND

BDRV

AGND

SS/ENABLE

V

FB

V

CORE

PWRGD

OVP

VID4

VID3

1

20

219

318

417

516

615

714

813

912

10

11

TDRV

V

CC12

V

CC5

V

OUT2

V

CC3

L

DRV

L

FB

VID0

VID1

VID2

TDRV

V

CC12

V

CC5

V

OUT2

V

CC3

L

DRV

L

FB

VID0

VID1

VID2

PGND

BDRV

AGND

SS/ENABLE

V

FB

V

CORE

PWRGD

OVP

VID4

VID3

DW PACKAGE — 20-Pin

(Top View)

1

20

219

318

417

516

615

714

813

912

10

11